Massive demands are being placed on computing due to skyrocketing increases in data consumption. Penetration of AI and ML into more and more fields require real-time, fast processing at the edge was well as fast data transfer to data centers for analysis. 5G and 6G technologies demand ever-increasing frequency for wireless communications. Autonomous driving and other harsh environments demand high reliability.
The semiconductor industry needs to continuously deliver better performance from a smaller footprint with higher frequency response, higher reliability and lower power consumption – and all with a lower barrier for entry than advances at the transistor level. How are these rigorous market demands influencing innovations in chip manufacturing and advanced interconnect such as hybrid bonding?
You’ll learn about:
- The hybrid bonding technology
- How it enables disaggregation and heterogenous integration and helps increase efficiency and performance while shrinking the footprint
- How it enables high reliability
Speaker:
- Guilian Gao, Distinguished Engineer, 3D Technology, Adeia
Moderator:
