As AI workloads continue to scale, thermal management has become one of the most critical challenges in semiconductor design. The increasing power density of modern compute platforms demands innovative cooling architectures that can efficiently dissipate heat while supporting performance, reliability, and package integration requirements.

At ECTC 2026, Adeia will present new advancements in direct-to-chip liquid cooling integration designed to address these emerging thermal challenges for AI hardware and compute-intensive applications.

Presentation Details

Advances in Direct-to-Chip Liquid Cooling Integration
Thursday, May 28, 2026
11:55 AM — Palazzo D

ECTC Session 13: Advances in Thermal Design and Characterization

This presentation highlights innovations in direct-to-chip liquid cooling integration and explores how advanced thermal solutions can help enable the next generation of high-performance computing systems.

The session will be presented by Dr. Laura Mirkarimi, SVP of Semiconductor Engineering at Adeia. Dr. Mirkarimi leads the company’s Semiconductor Engineering team, driving innovation across advanced packaging, metrology, and thermal technologies. Widely recognized for her pioneering work in hybrid bonding, she has authored more than 60 technical publications and holds over 100 granted patents.

As AI accelerators and high-density compute systems push traditional air-cooling methods to their limits, direct liquid cooling is emerging as a key enabler for future semiconductor architectures. Integrating cooling solutions directly at the chip level can improve thermal efficiency, reduce energy consumption, and support higher compute performance within increasingly constrained package footprints.

Adeia’s work in this area focuses on advanced integration approaches that address both thermal performance and manufacturability. By combining expertise in semiconductor packaging and thermal engineering, Adeia continues to develop technologies aimed at supporting the evolving demands of data centers, AI infrastructure, and next-generation electronic systems.

Attendees interested in advanced packaging, AI hardware, thermal design, and semiconductor innovation are encouraged to attend the session and learn more about Adeia’s latest research.

To explore additional details about Adeia’s presence at ECTC 2026 and todownload the technical brief to learn more about Adeia’s approach to advanced thermal integration and cooling technologies. https://marketing.adeia.com/adeia-at-ectc