Adeia engineers and scientists develop semiconductor innovations that address some of the industry’s most critical challenges — from bandwidth and interconnect bottlenecks to thermal demands of high-performance computing to integration of multi-functionality systems within a package. Our technologies span semiconductor design, hybrid bonding, advanced packaging, thermal management, and next-generation interconnect architecture to enable faster, more efficient and scalable systems.

As AI workloads expand in hyperscale data centers to edge devices and intelligent IoT systems, the semiconductor industry is undergoing one of its most significant architectural shifts in decades. Adeia innovations in hybrid bonding, chiplet integration, co-packaged optics, and liquid cooling are helping enable the next generation of logic, memory, RF, image sensor, and optical systems architectures powering AI, mobile, networking, and high-performance computing platforms.

Explore the semiconductor market segments being transformed by technologies developed by Adeia.