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Hybrid bonding, a foundational 3D integration technology, is increasingly being deployed in a range of semiconductor applications from image sensors to memory to reduce form factor, lower cost, enhance performance and increase functionality. In imaging applications, DBI technology has been leveraged to improve image quality, increase signal-to-noise ratios, and enable advanced features.

We are very pleased to conclude this agreement with Comcast, one of the world’s leading media and technology companies that is widely recognized for its innovative products and solutions,” said Samir Armaly, president, IP licensing of Xperi.

The patents at issue in the order cover innovations generally relating to multi-room DVR and communication between multiple set-top boxes using MoCA technology. These patents are just a few of approximately 11,000 Xperi patents and applications broadly licensed across its platform to companies in the media and semiconductor markets.

TiVo® today announced a multiyear extension and expansion of agreements for TiVo’s media-related patent portfolios.

Xperi Holding Corporation today announced its new senior leadership team following the completion of the merger between Xperi and TiVo.

Xperi Holding Corporation (NASDAQ: XPER) (“Xperi”) and Tower Semiconductor (NASDAQ/TASE: TSEM) (“Tower”), a global leader in high-value analog semiconductor foundry solutions, today announced Tower’s license of Invensas ZiBond ® and DBI ® 3D semiconductor interconnect technologies. This technology complements Tower’s manufacturing of its state of the art stacked wafer BSI sensor platforms for time of flight (ToF), industrial global shutter and other CMOS image sensors on 300mm and 200mm wafers. In addition, Tower Semiconductor will explore the use of Invensas enabling 3D integration technologies for a broader range of applications, including memories and MEMS devices.