Results For
Adeia Named One of the "Most Innovative Companies to Watch 2025" by The CEO Vision
March 17, 2025
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Revolutionizing Live Streaming: Real-Time Object Replacement for Interactive Experiences
March 3, 2025
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The Future of Faster, Smaller, and More Efficient Chips: A Breakthrough in Hybrid Bonding
February 24, 2025
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Making Video Streaming Faster and Smoother: A Smart New Approach to Internet Traffic
February 10, 2025
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Transforming Vehicle Communication: Adeia's Virtual DLP Headlight Innovation Wins Double Gold
January 22, 2025
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Pioneering the Future: Adeia's Hybrid Bonding Leadership Takes Center Stage at IEEE Symposium
January 16, 2025
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Breaking New Ground in Chip Technology: Adeia's Advanced Packaging Technology Solutions
November 13, 2024
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Revolutionizing Image Search: The Power of Vectorized Search and Adversarial Techniques
October 29, 2024
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Adeia Takes Center Stage: Unveiling the Future of Hybrid Bonding Technology
September 30, 2024
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Multi-Device Video Consumption and AI are Reshaping the E-Commerce Landscape
September 4, 2024
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Highlights from Adeia’s Innovations in Extended Reality at the 2024 Augmented World Expo (AWE)
August 22, 2024
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Increasing the Throughput of Hybrid Bonding Inspection Using Novel Methods and Machine Learning
July 8, 2024
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Adeia Presents Hybrid Bonding Technology at 2024 LES Silicon Valley Conference
June 14, 2024
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Adeia's CEO Explores the Role of Trust and the Future of Intellectual Property in Today's Innovation Society
June 3, 2024
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ACM Mile High Video and Streaming Media NYC 2024 Recap: User Experience is the Research Wave of the Future
July 15, 2024
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Exploring the Impact of Artificial Intelligence Applications on the Semiconductor Sector
January 17, 2024
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Technology-enabled Strategies Form Basis for Differentiation for Video Entertainment
December 5, 2023
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Ecosystem-wide Integration, Collaboration and Optimization offers Key to Accelerating the Path to XR Experience Adoption
September 13, 2023
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The Role of Vision-based Interfaces in Redefining Digital Entertainment User Experiences
July 31, 2023
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Transformational Impact of Artificial Intelligence on the Digital Entertainment Value Chain
February 10, 2025
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Planning and Automatically Capturing the Desired Moment in Photography: Presented at IEEE ICCE 2024
February 10, 2025
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Webinar: AVOD, FAST, Freemium: Effective Advertising in the New Video Landscape
February 10, 2025
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Considerations for the Delivery of Latency-Sensitive, Compute-Intensive Experiences Over a Communication Network
February 10, 2025
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Towards Active Participation in Virtual Social Worlds: Using Technology to Build Communities’ at AWE 2023
February 10, 2025
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Defining the Live Sports Streaming Experience: Today’s Trends and Tomorrow’s Opportunities
February 10, 2025
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Live Streaming at Scale – Conquering Next Gen Challenges: Presented at StreamTV World Virtual
February 10, 2025
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Webinar: Hybrid Bonding: Greater Functionality, Higher Performance & Smaller Size
February 10, 2025
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Compressing the Metaverse, Presented at SMPTE Media Technology Summit 2022
February 10, 2025
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Streaming Media Sneak Preview: Computing While Cooling With Netflix, Adeia, the Greening of Streaming, and Help Me Stream Research Foundation
April 22, 2024
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Adeia Presents Metrology Techniques for Improved Yield in Hybrid Bonding at IMAPS Device Packaging Conference 2024
March 19, 2024
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How streaming services can seek differentiation with technology-enabled engagement strategies
February 19, 2024
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Adeia Viewpoint: Streaming Service Providers Seek Differentiation with Technology-enabled Engagement Strategies
February 22, 2024
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Adeia Viewpoint: Cross-platform Content Navigation Emerges as Key to Consumer Engagement
February 18, 2024
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Adeia CEO dishes about firm’s first year of operations after Xperi spin-out
February 18, 2024
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Household Spending On Streaming Subscriptions Drops To $73 a Month (Down From $90 In 2021)
February 22, 2024
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Q-band InP/CMOS receiver and transmitter beamformer channels fabricated by 3D heterogeneous integration Read the Full Post Here
Low Cost of Ownership scalable copper Direct Bond Interconnect 3D IC technology for three dimensional integrated circuit applications Read the Full Post Here
Process compatibility of conventional and low-temperature curable organic insulation materials for 2.5D and 3D IC packaging — A user's perspective Read the Full Post Here
Analytical and Experimental Studies of 2.5D Silicon Interposer Warpage: Impact of Assembly Sequences, Material Selection and Process Parameters Read the Full Post Here
Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS Applications Read the Full Post Here
Thermal and Electrical Performance of Direct Bond Interconnect Technology for 2.5 and 3D Integrated Circuits Read the Full Post Here
Development of Low Temperature Direct Bond Interconnect Technology for Die-To-Wafer and Die-To-Die Applications-Stacking, Yield Improvement, Reliability Assessment Read the Full Post Here
Chip to Wafer Hybrid Bonding with Cu Interconnect: Manufacturability and High Volume Compatibility Study Read the Full Post Here
Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications Read the Full Post Here
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