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Adeia Inc. is demonstrating the most recent developments in clickable video at the 2024 Computer Vision and Pattern Recognition (CVPR) conference at the Seattle Convention Center in Seattle, Washington, from June 17-21, 2024.

Today, Adeia Inc. announced recent developments in hybrid bonding a technology targeted toward the future of semiconductor packaging enabling high-performance computing capabilities, like those required for AI.

Adeia Inc. announced that Dr. Aldis Sipolins, senior manager of advanced R&D at Adeia, will participate in a panel about the role of research in gaming innovation on Thursday, June 13, from 12:40 to 1:40 pm EDT during the 2024 XP Game Summit.

Adeia Inc. is presenting the most recent developments in semiconductor co-optimization at the 2024 SEMI 3D & Systems Summit at the Hilton Dresden Hotel in Dresden, Germany, from June 12-14, 2024.

If innovation is to continue to drive the global economy, more efforts will have to be invested in shoring up "trust" in the conventions and institutions that underpin the international intellectual property community.

Adeia Inc. will share the latest developments in hybrid bonding technology during the premier advanced packaging conference, Electronic Components and Technology Conference (ECTC) at the Gaylord Rockies Resort and Convention Center in Denver, Colorado from May 28 to May 31, 2024.