DBI Ultra hybrid bonding makes it possible to manufacture 4, 8, 12 or 16-high 3D stacked memory while meeting the stringent packaging height and performance requirements for next-generation high-performance computing.

DBI Ultra enables high bandwidth and high performance 2.5D and 3D integration of memory, CPU, GPU, FPGA or SoC.

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DBI® Ultra hybrid bonding enables high-bandwidth and high-performance computing with 2.5D, 3D, and 3.5D integration of logic and memory applications including HBM, CPU, GPU, FPGA, or SoC.

DBI Ultra hybrid bonding makes it possible to manufacture 4, 8, 12 or 16-high 3D stacked memory while meeting the stringent packaging height and performance requirements for next-generation high-performance computing.

DBI Ultra enables high bandwidth and high performance 2.5D and 3D integration of memory, CPU, GPU, FPGA or SoC.

‍

DBI Ultra hybrid bonding makes it possible to manufacture 4, 8, 12 or 16-high 3D stacked memory while meeting the stringent packaging height and performance requirements for next-generation high-performance computing.

DBI Ultra enables high bandwidth and high performance 2.5D and 3D integration of memory, CPU, GPU, FPGA or SoC.

‍

Related Resources

Video / Presentation

Hybrid Bonding Technologies: Die-to-Wafer Bonding

See how Adeia’s demonstration of die-to-wafer hybrid bonding eliminates the need for copper pillars and underfill while resulting in dramatically thinner stacks.

Video / Presentation

Hybrid Bonding Technologies: Wafer-to-Wafer Bonding

Watch this demonstration of low-temperature wafer-to-wafer hybrid bonding, allowing for exceptionally fine pitch 3D electrical interconnect

Video / Presentation

Hybrid Bonding: Greater Functionality, Higher Performance & Smaller Size

Introducing ZiBond and DBI hybrid bonding technologies: enable leading edge functionality and accelerate time to market for a wide variety of semiconductor products.

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