Watch this demonstration of die-to-wafer hybrid bonding bonding.

By eliminating the need for copper pillars and underfill, DBI Ultra enables a dramatically thinner stack as compared to conventional approaches. DIt also allows the stacking of die that are the same or different sizes, processed on fine or coarse wafer process technology nodes, or manufactured on the same or different wafer sizes while readily scaling to 1 µm interconnect pitch, providing the ultimate 2.5D and 3D integration flexibility.

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