Semiconductor

Resources

At Adeia, ideas are at the heart of everything we do. Learn more about the innovations that advance how we live, work and play.

Video / Presentation

Hybrid Bonding Technologies: Wafer-to-Wafer Bonding

Watch this demonstration of low-temperature wafer-to-wafer hybrid bonding, allowing for exceptionally fine pitch 3D electrical interconnect

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Video / Presentation

Hybrid Bonding: Greater Functionality, Higher Performance & Smaller Size

Introducing ZiBond and DBI hybrid bonding technologies: enable leading edge functionality and accelerate time to market for a wide variety of semiconductor products.

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Video / Presentation

Ideas to Innovations

Adeia’s 30 years of semiconductor research and development is enabling innovations in chip scale packaging, delivering smaller, faster, denser interconnects for enhanced data transfer.

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Product Brief

DBI® Ultra Die-to-Wafer Hybrid Bonding

The ultimate 2.5D & 3D integration technology for high performance computing

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Product Brief

Low Temperature Wafer Bonding and 3D Interconnect for RF Devices

Create small, reliable, cost effective RF front-end devices for 4G LTE & 5G mobile applications

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Product Brief

3D Integration for MEMS Devices

Small, reliable and cost effective multi-functional integrated solutions

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Product Brief

Pixel Level 3D Integration for Advanced Stacked CMOS Image Sensors

Revolutionizing the image sensor industry by enabling improved sensitivity, high dynamic range (HDR) & lower cost

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Product Brief

High Density Low Cost Stacked 3D NAND with Hybrid Bonding

Memory array and logic disaggregation 64, 96, 128 layers and beyond for 3D NAND

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Innovations that span industries

Our fundamental technology enables innovation in the entertainment and electronics industries.

panasonic
roku
samsung
sony
tcl
vizio
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Interested in Working with Us?

Through our Technology Transfer Program, we act as an extension of your R&D team to help you accelerate product development cycles utilizing our groundbreaking innovations.

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  • Igniting Innovation

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