Video / Presentation

Ideas to Innovations

Defining the future

Adeia’s 30 years of semiconductor research and development is enabling innovations in chip scale packaging, delivering smaller, faster, denser interconnects for enhanced data transfer.

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Defining the future

Adeia’s 30 years of semiconductor research and development is enabling innovations in chip scale packaging, delivering smaller, faster, denser interconnects for enhanced data transfer.

‍

Markets:

Logic
Memory

Technology:

Hybrid Bonding

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Hybrid Bonding Technologies: DBI® Ultra

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Hybrid Bonding Technologies: Die-to-Wafer Bonding

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