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May 22, 2026
Adeia is excited to attend the Electronic Components and Technology Conference (ECTC) and showcase innovations helping shape the future of AI and high-performance computing. Visit us at Booth #804 to connect with our team and learn more about the technologies advancing next-generation semiconductor and thermal solutions.
Presented by Ron Zhang | Thursday, May 28, 2026 | 8:00 AM | Room 3
ITherm Session: Liquid Cooling Solutions and System Integration
As AI processors and advanced computing platforms continue to drive higher thermal loads, efficient cooling solutions are becoming increasingly critical. This presentation explores innovative partitioned flow strategies designed to improve microchannel cooling performance, optimize heat transfer, and support the thermal demands of next-generation AI systems.
The work highlights experimental validation methods and design approaches that can help improve cooling efficiency, reliability, and scalability in high-density computing environments — key priorities for the AI era.
Attendees interested in advanced packaging, thermal management, and AI infrastructure innovation are encouraged to visit Adeia at Booth #804 during ECTC.
To learn more about the research and technology behind the presentation, download the executive summary below.
Learn more and connect with Adeia at ECTC. Download the executive summary.
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Dr. Ron Zhang leads the Advanced Packaging and Thermal Solutions team at Adeia, driving innovation in packaging integration and data center cooling. He is recognized for his work in system-level architecture bridging device, package, and infrastructure to enable next-generation AI systems. He has contributed to co-packaged optics and direct liquid cooling solutions. Dr. Zhang earned his Ph.D. in Mechanical Engineering and Applied Mechanics from the University of Michigan.
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