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June 11, 2024

Adeia Inc. Celebrates Remarkable Semiconductor Achievements in 2024

Adeia Inc. Celebrates Remarkable Semiconductor Achievements in 2024

At Adeia Inc., we're thrilled to share the highlights of an exciting and productive 2024. As a leading R&D company, we are dedicated to driving innovation in the semiconductor technology sector. This year, our advancements and partnerships have solidified our position at the forefront of these industries.

Milestones in Semiconductor Innovation

One of our most significant achievements in 2024 stems from the long-term agreements we secured in 2023 with Kioxia Corporation and Western Digital. These world leaders in flash memory and solid-state drives have licensed Adeia’s semiconductor patent portfolio, including our groundbreaking hybrid bonding technology.

What is Hybrid Bonding?

Hybrid bonding is an advanced semiconductor packaging technology that integrates various functional elements—such as logic, memory, and sensors—into compact, high-performance systems. Using the direct bond interconnect (DBI®) process, this technology connects different semiconductor components, significantly enhancing electrical and thermal performance.

Educational and Thought Leadership Contributions

In early 2024, our semiconductor team showcased their expertise at prominent industry events:

  • Chiplet Summit: Our team delivered a tutorial on “Design Considerations for Hybrid-Bonded Chiplets” and participated in a panel discussion on “Best Packaging for Chiplets Today.”
  • Device Packaging Conference 2024: We presented a paper titled "Surface Metrology and Defect Characterization for Hybrid Bonding,” highlighting our research and innovations.

Our team’s knowledge continues to be a valuable resource for the industry. Laura Mirkarimi, our Senior Vice President and Head of SEMI Engineering, has been sought after for her insights in interviews with 3DinCities and in the forthcoming book, Hybrid Bonding: The Time has Come.

Recognition for Innovation

We are proud to announce that our semiconductor team received the “Best Session Paper” award at ECTC 2023 for their article, “Fine Pitch Die-to-Wafer Hybrid Bonding.” This recognition underscores our commitment to advancing hybrid bonding technology and addressing yield loss mechanisms.

Looking Ahead

Adeia’s consistent innovation and strategic partnerships are shaping the future of semiconductor technology. As we continue to push the boundaries of what’s possible, we remain dedicated to enhancing experiences for consumers around the world.

Stay tuned for more exciting updates!

Thomas Workman Wins "Best Paper 2023" at ECTC

Increasing the Throughput of Hybrid Bonding Inspection Using Novel Methods and Machine Learning

Adeia Presents Hybrid Bonding Technology at 2024 LES Silicon Valley Conference

Adeia Inc. Celebrates Remarkable Semiconductor Achievements in 2024

Laura Mirkarimi

SVP Engineering

Laura Mirkarimi, SVP Engineering at Adeia-Semiconductor, leads the research and development of technology in hybrid bonding, advanced packaging, and thermal management for future generations of electronic products. Before joining Adeia, she developed electronic devices, including ferroelectric memory, transparent conductors, and photonic crystal sensors at Hewlett Packard Laboratories for 12 years. She earned a PhD in Materials Science at Northwestern University and a B.S. in Ceramic Science & Eng. from Pennsylvania State University. She holds over 100 patents and has 60 technical publications.