Adeia, the pioneer in hybrid bonding technology and gold sponsor of the upcoming IEEE Hybrid Bonding Symposium, continues to lead the industry's advancement toward commercialization of this transformative packaging technology. The symposium, taking place January 16-17, 2025, at SEMI International in Silicon Valley, CA, brings together over 200 registrants to explore the technology that Adeia has helped shape from its earliest developments.

Distinguished Engineer Dr. Guilian Gao, representing Adeia'sdeep expertise in hybrid bonding innovation, will set the tone for the symposium with the opening presentation on January 16th. Dr. Gao's selection as both Thursday morning session co-chair and afternoon panel discussion participant reflects Adeia's foundational role in developing and advancing hybrid bonding technology for commercial applications.

The comprehensive symposium, hosted at the heart of the technology industry, showcases how the semiconductor ecosystem has evolved around the groundbreaking hybrid bonding advances pioneered by companies like Adeia. The diverse speaker lineup represents a unique convergence of expertise from three continents, demonstrating how hybrid bonding technology has gained global recognition and adoption.

Building on Adeia's early vision for hybrid bonding's potential, major industry players will share their implementation experience sat the Silicon Valley event. Sony, a leading integrated device manufacturer(IDM), will share insights from their production experience, while Nhanced Semiconductors brings a valuable perspective as a bonding fabrication provider. Presentations from world-renowned research institutions, including IMEC, ITRI,CEA-Leti, Tohoku University, National Yang-Ming Chiao Tung University, UCLA, and Nagoya University, further enhance the symposium's technical depth.

The two-day event's comprehensive coverage reflects how the hybrid bonding ecosystem has matured since its pioneering days. Synopsys will address the critical aspect of design tools while leading equipment suppliers, including Besi, EVG, TEL, AMAT, and Onto, will showcase their latest technological developments. Metrology solutions will be highlighted by PVATePla, Excillum AB, and Sigray, while Brewer Science and Toray will present material innovations.

The strong registration numbers for this symposium validate Adeia's long-standing vision of hybrid bonding as a crucial technology for next-generation semiconductor packaging. As the semiconductor industry continues to push the boundaries of performance and integration, the technology that Adeia helped pioneer emerges as a key enabler for advanced packaging solutions, offering improved electrical performance, higher interconnect density, and enhanced system integration capabilities.

This gathering of industry leaders, researchers, and technology providers at SEMI International creates an ideal platform for knowledge exchange and collaboration, building upon the foundation laid by early innovators like Adeia. The symposium's focus on commercialization marks a crucial milestone in the journey that Adeia helped initiate, as the industry moves from research and development toward widespread implementation of hybrid bonding technology in commercial applications.

Adeia's gold sponsorship of this event underscores the company's continued commitment to advancing the technology they helped pioneer. Their support demonstrates their ongoing dedication to fostering industry collaboration and pushing the boundaries of semiconductor packaging technology. As the industry continues to evolve, Adeia's early vision and ongoing leadership play a crucial role in accelerating the adoption of innovative technologies and ensuring their successful commercialization.

The IEEE Hybrid Bonding Symposium promises to be a landmark event for the semiconductor packaging industry, highlighting how far the technology has come since its inception and where it's headed next. With its comprehensive program, distinguished speakers, and focus on commercialization, the Silicon Valley symposium is set to provide valuable insights and foster important discussions that will help drive the industry forward, building upon the pioneering foundation established by industry leaders like Adeia.