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With the rising cost and complexity of cutting-edge semiconductor manufacturing processes, the industry is increasingly looking beyond Moore’s Law towards advanced packaging and 3D integration technologies.

Leveraging the combination of our highly experienced technologists, scientists and engineers and our advanced research and development labs in San Jose, California and Raleigh, North Carolina, we develop industry-leading 3D integration solutions such as hybrid bonding that meet the demand for greater functionality, higher performance and smaller size for next generation electronics.

Click here to learn more about our semiconductor solutions.

Greater Functionality

3D integration technologies are playing an increasingly vital role in semiconductors enabling new and enhanced functionality in mobile, cloud, storage & AR/VR devices.

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Greater
Functionality

3D integration technologies are playing an increasingly vital role in semiconductors enabling new and enhanced functionality in mobile, cloud, storage & AR/VR devices.

DBI UltraHybrid DataCenter

Higher Performance

Hybrid bonding solutions with ultra-high-density 3D interconnect allow chip architectures to be redefined enabling higher bandwidth, lower latency and less power.

Smaller Size

Innovative 3D miniaturization technologies reduce device footprint and thickness resulting in more compact electronics.
Small chip
Small chip

Smaller Size

Innovative 3D miniaturization technologies reduce device footprint and thickness resulting in more compact electronics.

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