With the rising cost and complexity of cutting-edge semiconductor manufacturing processes, the industry is increasingly looking beyond Moore’s Law towards advanced packaging and 3D integration technologies.
Leveraging the combination of our highly experienced technologists, scientists and engineers and our advanced research and development labs in San Jose, California and Raleigh, North Carolina, we develop industry-leading 3D integration solutions such as hybrid bonding that meet the demand for greater functionality, higher performance and smaller size for next generation electronics.
Greater Functionality
3D integration technologies are playing an increasingly vital role in semiconductors enabling new and enhanced functionality in mobile, cloud, storage & AR/VR devices.


Greater
Functionality
3D integration technologies are playing an increasingly vital role in semiconductors enabling new and enhanced functionality in mobile, cloud, storage & AR/VR devices.

Higher Performance
Smaller Size


Smaller Size
What is Hybrid Bonding?
Hybrid bonding allows semiconductor wafers to be bonded with exceptionally fine-pitch 3D electrical interconnects at room temperature without pressure or adhesives. During hybrid bonding, dielectric surfaces with embedded metal bond pads are polished for minimal surface roughness. They are dished slightly, and then nitrogen-based chemistries are applied. Prepared wafers can be easily aligned together, resulting in strong chemical bonds between the prepared surfaces. After a moderate batch anneal, the bond pads expand to form a homogeneous metallic interconnect with grain growth across the bond interface. The chemical bond between oxides is significantly strengthened, ensuring high reliability without needing under-fill.
DBI Wafer-to-Wafer Hybrid Bonding
DBI® is a low temperature hybrid direct bonding technology that allows wafers to be bonded with exceptionally fine pitch 3D electrical interconnect.
Join Our Email List
We turn ideas into innovations, and we’re excited to bring you along with us.
Get innovation delivered to your inbox.