Massive demands are being placed on computing due to skyrocketing increases in data consumption. Penetration of AI and ML into more and more fields require real-time, fast processing at the edge was well as fast data transfer to data centers for analysis. 5G and 6G technologies demand ever-increasing frequency for wireless communications. Autonomous driving and other harsh environments demand high reliability.
The semiconductor industry needs to continuously deliver better performance from a smaller footprint with higher frequency response, higher reliability and lower power consumption – and all with a lower barrier for entry than advances at the transistor level. How are these rigorous market demands influencing innovations in chip manufacturing and advanced interconnect such as hybrid bonding?
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