Product Brief

Low Temperature Wafer Bonding and Fine Pitch 3D Interconnect

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Markets:

Image Sensors
RF Front End
Memory
Logic

Technology:

Hybrid Bonding

Related Resources

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Hybrid Bonding Technologies: DBI® Ultra

DBI® Ultra hybrid bonding enables high-bandwidth and high-performance computing with 2.5D, 3D, and 3.5D integration of logic and memory applications including HBM, CPU, GPU, FPGA, or SoC.

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Hybrid Bonding Technologies: Die-to-Wafer Bonding

See how Adeia’s demonstration of die-to-wafer hybrid bonding eliminates the need for copper pillars and underfill while resulting in dramatically thinner stacks.

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Hybrid Bonding Technologies: Wafer-to-Wafer Bonding

Watch this demonstration of low-temperature wafer-to-wafer hybrid bonding, allowing for exceptionally fine pitch 3D electrical interconnect

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