Data center cooling is broken — and Adeia's RapidCool™ is here to fix it.

As AI and HPC workloads push chip power densities to new extremes, conventional liquid cooling methods simply can't keep up. RapidCool™ Technology eliminates the traditional thermal interface material (TIM) layer entirely, bonding a silicon cold plate directly to the chip for dramatically superior performance:

• 10x lower thermal resistance than conventional cooling
• 100x lower pressure drop vs. traditional microchannels
• Single-structure design that integrates with existing server  infrastructure
• No TIM. No compromise. Just faster, cooler compute.

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