Adeia is a leader in advanced packaging, with pioneering work in Direct Bond Interconnect (DBI®) hybrid bonding technologies.

Our direct bonding interconnect (DBI®) hybrid bonding technologies make it possible to bond chips and wafers with ultra-fine pitch 3D electrical interconnects on industry-standard wafer bonding equipment, at room temperature, without pressure or adhesives. The process produces pristine, all-copper interconnect surrounded by an inorganic dielectric that delivers high reliability and enhanced thermal performance.

DBI Wafer-to-Wafer (W2W) Hybrid Bonding is ideal for applications with the same size die on each wafer, such as image sensors, antenna switches, and 3D NAND memory stacks to enhance manufacturing efficiency, reduce production costs, and improve device performance.

DBI Ultra is a die-to-wafer and die-to-die hybrid bonding technology platform that enables stacking with any die size, processed on diverse technology nodes, and fabricated on different wafer sizes and materials. DBI Ultra is ideal for advanced 2.5D, 3D, and 3.5D heterogeneous integration of memory and logic systems that include HBM, CPUs, GPUs, TPUs, or SoCs.

Adeia research has led to innovations in a wide range of packaging technologies, including:

• Bond pad
• Metal microstructure
• TSV
• DBI integration
• Stress compensation
• Interconnect structure
• Chiplets
• Die to wafer
• Reconstitution
• DBI on substrate
• Backside power and delivery