Memory array and logic disaggregation 64, 96, 128 layers and beyond for 3D NAND.
Create small, reliable, cost effective RF front-end devices for 4G LTE & 5G mobile applications.
Revolutionizing the image sensor industry by enabling improved sensitivity, high dynamic range (HDR) & lower cost.
Enabling a wide range of high performance, scalable, cost effective IC solutions with ZiBond® & DBI® technologies.
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