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Introducing ZiBond and DBI Technologies
Used in over 1 Billion devices, ZiBond and DBI offer fast and cost effective bonding.
High Density Low Cost Stacked 3D NAND with Hybrid Bonding
Memory array and logic disaggregation 64, 96, 128 layers and beyond for 3D NAND.
Low Temperature Wafer Bonding and 3D Interconnect for RF Devices
Create small, reliable, cost effective RF front-end devices for 4G LTE & 5G mobile applications.
Pixel-Level 3D Integration for Advanced Stacked CMOS Image Sensors
Revolutionizing the image sensor industry by enabling improved sensitivity, high dynamic range (HDR) & lower cost.
3D Integration for MEMS Devices
Small, reliable and cost effective multi-functional integrated solutions.
Low Temperature Wafer Bonding and Fine Pitch 3D Interconnect
Enabling a wide range of high performance, scalable, cost effective IC solutions with ZiBond® & DBI® technologies.
DBI® Ultra Die-to-Wafer Hybrid Bonding
The ultimate 2.5D & 3D integration technology for high performance computing.
Wafer-To-Wafer Bonding
Wafer-to-Wafer Bonding: Learn about low temperature hybrid direct bonding technology that allows wafers to be bonded with exceptionally fine pitch 3D electrical interconnect.
Introducing DBI Ultra
DBI Ultra makes it possible to manufacture 4, 8, 12 or 16-high 3D stacked memory while meeting the stringent packaging height and performance requirements…
Die-To-Wafer Bonding
Die-to-Wafer Bonding: Learn about low-temperature, low profile die-tow-wafer hybrid bonding.
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