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At Adeia, our experts innovate beyond conventional semiconductor technologies, creating advanced solutions that are revolutionizing the design and manufacturing of electronics and shaping the future of the semiconductor industry.
Our hybrid bonding solutions enable chips and wafers to be bonded with ultra-fine pitch 3D electrical interconnects at room temperature without pressure or adhesives.
This patented process uses a modest thermal treatment to create a pristine, all copper interconnect surrounded by inorganic dielectric that delivers high reliability and enhanced thermal performance.
DBI wafer-to-wafer hybrid bonding is a low temperature technology platform that leverages industry-standard wafer bonding equipment. High-throughput, low-cost 3D interconnects can be realized for your high-volume market applications. The DBI platform is ideal for applications with the same size die on each wafer, such as image sensors, antenna switches, and 3D NAND memory stacks to enhance manufacturing efficiency, reduce production costs, and improve device performance.
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DBI Ultra is a low-temperature, die-to-wafer and die-to-die hybrid bonding technology platform that enables stacking with any die size, processed on diverse technology nodes, and fabricated on different wafer sizes and materials. DBI Ultra is ideal for advanced 2.5D, 3D, and 3.5D heterogeneous integration of memory and logic systems that include HBM, CPUs, GPUs, TPUs, or SoCs.
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In 1965, Gordon E. Moore predicted that microchips would evolve, becoming smaller, faster, more functional, and less expensive to manufacture as technology progressed. Today, modern microprocessors are more powerful and smaller. However, rising costs and physical limitations have stalled advancements. As transistor scaling slows, innovations, like DBI hybrid bonding, have emerged to extend the relevance of Moore’s Law. Adeia’s work in this field is fundamental to future advancements, potentially enabling unprecedented connection densities of 7-million links per square millimeter of silicon.
Through our Technology Transfer Program, we act as an extension of your R&D team to help you accelerate product development cycles utilizing our groundbreaking innovations.
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